Description
SMX-30PLUS is a solvent, and water-free universal parquet adhesive. Suitable for bonding many types of parquet floors onto suitable indoor substrates.
Characteristics
- Ready to use, no mixing required
- Remains flexible
- Single component ready to use system
- EC-1R Plus label: very low emission values
- Solvent free
- Contains no water
- Free of isocyanates
- Easy to apply
- Forms stable peaks when applied with a notched trowel or spreader comb
- Rapid cure and build up of final bond strength
- High final bond strength (according to EN14293)
- Remains permanently elastic
- Suitable for subfloor heating
- Avoids staining of the hands
Applications
SMX-30PLUS is a solvent, and water-free universal parquet adhesive based upon SMX Polymers. Suitable for indoor bonding of all types of wooden floors such as solid, stab, pre-finished, and on-end parquet, wood-planks up to 18cm wide, wood-block and laminates.
Suitable for use on porous and non-porous substrates such as mosaic, anhydrite, concrete, screeds, wood, chipboard and OSB Board (large
particle size chipboard) , including floors with underfloor heating.
SMX-30PLUS is also extremely suitable for bonding moisture sensitive wood onto moderately porous surfaces.
Directions for use
SMX-30PLUS should be acclimatised to room temperature before installation. Apply the adhesive to the surface by means of notched SOUDAL trowel N°11. For parquet sizes smaller than 60mm wide and 300mm long notched SOUDAL trowel N°3 is recommended. Do not apply more to the surface than can be covered with parquet within 40 minutes. Slide the parquet onto the adhesive layer and tap into place or tamp down with a rubber hammer.
A minimum of 80% contact coverage is required to ensure a perfect adhesion. Loading the parquet with weights will improve the final bond strength. Wait at least 12 hours before sanding and finishing the parquet.
Uncured SMX-30PLUS may be removed from tools and parquet with SOUDAL Adhesive cleaner. Cured adhesive must be removed mechanically.
Remarks
- Never install onto substrates, which are not protected against possible rising damp.
- Do not apply the adhesive at temperatures below 15°C or above 25°C
- Minimum temperature of the substrate should be at least 15°C.
- Do not apply the adhesive when the relative humidity is above 75%.
- Never install onto a substrate which contains too much moisture or onto substrates with a higher humidity value than recommended by the timber supplier.
- Never install timber which is too dry (<7% humidity). This type of timber can expand at higher humidity or when the humidity rises and cause damage.
- Do not install if the walls and ceilings of the area are not dry (e.g. after plastering or painting etc.)
- Do not dilute the adhesive.