Description
SMX-30P is a solvent, and water-free universal parquet adhesive. Suitable for bonding many types of parquet floors onto suitable indoor substrates.
Characteristics
- Ready to use, no mixing required
- Single component
- EC-1R label: very low emissions
- Solvent free
- Contains no water
- Free of isocyanates
- Easy to apply
- Forms stable peaks once applied by a notched trowel or spreader comb
- Rapid cure and build up of final bond strength
- High final bond strength (according to EN14293)
- Remains permanently elastic
- Suitable for underfloor heating
Applications
SMX-30P is a solvent, and water-free universal parquet adhesive based upon SMX Polymers.
Suitable for indoor bonding of all types of wooden floors such as solid, stab, pre-finished, and on-end parquet, wood-plank, wood-block and laminates.
Suitable for use on porous and non-porous substrates such as mosaic, anhydrite, concrete, screeds, wood, chipboard and OSB Board (large
particle size chipboard) , including floors with underfloor heating.
SMX-30P is also extremely suitable for bonding moisture sensitive wood onto moderately porous surfaces.
Directions for use
SMX-30P should be acclimatised to room temperature before installation. Apply the adhesive to the surface by means of notched SOUDAL
trowel N°11. For parquet sizes smaller than 60mm wide and 300mm long notched SOUDAL trowel N°3 is recommended. Do not apply more to the
surface than can be covered with parquet within 30 minutes. Slide the parquet onto the adhesive layer and tap into place or tamp down with a rubber hammer.
A minimum of 80% contact coverage is required to ensure a perfect adhesion. Loading the parquet with weights will improve the final bond strength.
Wait at least 24 h before sanding and finishing the parquet.
Remarks
· Never install to substrates, which are not protected against possible
rising damp.
· Do not apply the adhesive at temperatures below 15°C or above 25°C
· Minimum temperature of the substrate should be at least 15°C.
· Do not apply the adhesive when the relative humidity is above 75%.
· Never install onto a substrate which contains too much moisture or
onto substrates with a higher humidity value than recommended by
the wood supplier.
· Never install wood which is too dry (<7% humidity). This can expand
at higher humidity or when the humidity rises and cause damage.
· Do not install if the walls and ceilings of the area are not dry
(e.g. after plastering or painting etc.)
· When bonding parquet without tongue and groove, the board has to be
at least 10mm thick. When bonding to a wooden subfloor over
underfloor heating board should not be wider as 13cm. Insure enough
nails are used (every 3cm in width and every 40-50cm in length)
· Do not dilute the adhesive.