MS-20P Parquet Adhesive

Description
MS-20P is a solvent, and water-free universal parquet adhesive.
Suitable for bonding engineered board onto suitable indoor substrates.
Characteristics
- Ready to use, no mixing required
- Single component
- Solvent free
- Contains no water
- Free of isocyanates
- Easy to apply
- Forms stable peaks once applied by a notched trowel or spreader comb
- Rapid cure and build up of final bond strength
- High final bond strength (according to EN14293)
- Remains permanently elastic
- Suitable for underfloor heating
Applications
MS-20P is a solvent, and water-free universal parquet adhesive based upon MS Polymers. Suitable for indoor bonding of engineered boards and ready to use parquet.
Suitable for use on porous and non-porous substrates such as mosaic, anhydrite, concrete, screeds, wood, chipboard and OSB Board (large particle size chipboard) , including floors with underfloor heating.
Directions for use
MS-20P should be acclimatised to room temperature before installation. Apply the adhesive to the surface by means of notched SOUDAL trowel N°11. For parquet sizes smaller than 60mm wide and 300mm long notched SOUDAL trowel N°3 is recommended. Do not apply more to the surface than can be covered with parquet within 30 minutes. Slide the parquet onto the adhesive layer and tap into place or tamp down with a rubber hammer.
A minimum of 80% contact coverage is required to ensure a perfect adhesion. Loading the parquet with weights will improve the final bond strength.
Wait at least 24 h before sanding and finishing the parquet.
Uncured MS-20P may be removed from tools and parquet with SOUDAL Adhesive cleaner or SWIPEX. Cured adhesive must be removed mechanically.
Remarks
Never install flooring on subfloors, which are not protected against possible rising damp. Do not apply the adhesive at temperatures below 15°C or above 25°C Minimum temperature of the substrate should be at least 15°C. Do not apply the adhesive when the relative humidity is above 75%. Never install flooring on a substrate which contains too much moisture or on substrates with a higher humidity value than recommended by the wood supplier. Never install wood which is too dry
(<7% humidity). This can expand at higher humidity or when the humidity rises and cause damage. Do not install flooring if the walls and ceilings in the area are not dry (e.g. after plastering or painting etc.) Do not dilute the adhesive.